FR4 TG135 2 Layer PCB , ENIG 2u Surface 0.075mm PCB SMT Assembly

FR4 TG135 2-layer PCB ENIG 2u surface 0.075mm

FR4 TG135 is a substrate material used in the manufacture of printed circuit boards (PCBs). Its glass transition temperature (Tg) of 135°C indicates that it can withstand moderate temperatures during operation without losing its mechanical or electrical properties. A 2-layer PCB made with FR4 TG135 material refers to a PCB with two layers of substrate material and copper traces.

ENIG (Electroless Nickel Immersion Gold) is a surface treatment applied to copper traces and pads on the surface of PCBs. It involves depositing a layer of nickel over copper, followed by an immersion gold layer. This surface treatment provides excellent protection against oxidation and other forms of corrosion and is often used in high-reliability applications.

The 2u surface refers to the gold layer thickness of the ENIG finish. A 2u surface means that the immersion gold layer is 2 microns thick, which is the standard thickness for many ENIG finishes.

0.075 mm (75 microns) refers to the minimum track/clearance capability of the PCB. This means that the minimum distance between two copper lines on the surface of the PCB is 0.075mm, which indicates that the PCB is suitable for high-density applications where space is at a premium.

Shenzhen Jieteng Circuit Co., Ltd.
Since its establishment in 2009, it has been committed to the production of PCB circuit boards

FR4 TG135 2 Layer PCB

ENIG 2 Layer PCB

0.075mm PCB SMT Assembly

FR4 TG135 2 Layer PCB , ENIG 2u Surface 0.075mm PCB SMT Assembly Images